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Additional water vapor pumping is possible with an optional Meissner Trap. High partial pressure of water vapor is no longer a problem, even in areas of high humidity.
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The Model 2400-8L load lock system ensures a constant inert gas or vacuum environment allowing rapid p umpdown to base pressure and elimination of target pre-cleaning. Combined with the continuous substrate rotation feature, an infinite number of alloy compositions can be developed simply by varying the power division between target. With this feature, RF power can be applied to two cathodes simultaneously in any desired ratio from 5 to 95%. Power Splitting is an optional feature of the 2400-8SA system. As an added feature, up to three 8″ round cathodes may be specified allowing sequential deposition from several targets or alternately, static deposition or heating from any target position. A 4″ wafer vertical range of the table facilitates coating bulk substrates. Used in conjunction with a cathode shaping aperture, the rotating table permits high uniformity. The Perkin-Elmer Model 2400-8SA features a large 21 1/ 2” rotating, water cooled annular table with a capacity of sixty-four 2″, thirty 3″, or thirteen 4″ wafers. In a laboratory or low-volume production environment, where the high throughput levels of the 4400 Series are not required, the 2400 Series is the ideal alternative for high quality sputtering in a wide variety of applications. You are here: Home > Equipment > Perkin-Elmer 2400 Perkin-Elmer 2400